
P a g e | 14 S G B . d o c , R e v . R , V P , 1 1 / 5 / 1 0
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GHZ socket Mechanical Specifications
Individual contact force
Depth of penetration (mm)
Typical 1.27mm pitch BGA
i
Typical 1.0mm pitch BGA
ii
Typical 0.8mm pitch BGA
iii
Notes:
i
0.75mm Nominal solder ball diameter was used in the calculation.
ii
0.6mm Nominal solder ball diameter was used in the calculation.
iii
0.4mm Nominal solder ball diameter was used in the calculation.
Conductive Elastomer Life
Needs cleaning after 200 cycles. Shelf life: 1 year
Electrical Specifications
Mutual Capacitance (at PCB):
Mutual Capacitance (at device):
Current carrying capacity:
Notes:
1
Maximum contact resistance with 0.2mm compression (contact resistance will decrease with increased compression). Measurements
were taken using 0.4mm square electrodes. The 0.75mm value is interpolated from a test of 0.5mm, 1mm, and 2.0mm elastomers.
2
The test used 0.5mm wide Au plated electrodes with a 0.5mm gap between them. 500VDC was used with a 1mm thick elastomer
compressed 0.35mm.
3
Measurements were taken with a flat gold plated electrode. The 0.75mm value is interpolated from a test of several elastomer
thicknesses ranging from 0.1mm to 2.0mm.
4
This is a conservative estimate based on 1mm thick elastomer test results with test probes spaced at 0.5mm.
5
Measurements were taken with test probes at 0.5mm pitch. The 0.75mm value is interpolated from a test of several elastomer
thicknesses ranging from 0.1mm to 2.0mm.
6
The wires are on a 0.1x0.1mm grid and 0.05x0.05mm grid. Multiple wires make contact per solder ball based on its size and depth
of penetration. The following table shows typical BGA parameters and its current carrying capability.
# of contacting wire
per ball
Total current carrying
capacity (mA)
Elastomer Specification
Operating Temperature
Continuous usage: -35C to +85C, +100C for up to 250 hours
Compression set: 1 5 0 C fo r 2 2 h r s
Thickness change: -4.5%
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